STMicroelectronics introduces Stellar automotive MCUs with next-gen extensible memory, delivering scalability in SDV and EV ...

Infineon and Typhoon HIL are collaborating on a hardware simulation and test solution to accelerate the development of xEV power systems.

Samtec offers high stability Nitrowave microwave cable assemblies for lab test and rugged environments such as ...

Battery energy storage systems will play a key role in energy management as demand for sustainable and reliable energy ...

Broadcom’s 102.4-Tbits/s Ethernet switch chip, with options for 100G and 200G SerDes, targets scale-up and scale-out AI ...

Innovations in AI, AIoT, edge computing, and sensor fusion are driving the next generation of advances in smart cities and ...

Hirose introduces the FH79 Series back-flip FPC connector with a 40% reduction in width, targeting automotive and other harsh ...

Infineon introduces rad-hard GaN transistors, including one of the first DLA JANs-certified GaN devices, for space applications.

Integra Optics’ 800G transceivers address the growing demands of AI, cloud computing, and data center networks.

KOA Speer’s WN73H metal thin-film chip resistors deliver power ratings of 0.3 W in a 0306 package and 1 W in a 0612.

Bourns’ SRP2512CL and SRP3212CL power inductors deliver reduced losses and high efficiency to meet DDR5 memory specifications ...

NXP’s NTAG X DNA connected NFC tag, compatible with any NFC mobile device, combines high-density memory and a high data rate.